Ultra sounds improve precision drilling in glass
IIT Bombay researchers explained why Ultrasonic-Assisted Electrochemical Discharge Machining (UA-ECDM) is superior for drilling deep microholes in brittle glass. The mechanism involves ultrasonic vibrations acting like a plunger, enhancing debris removal efficiency by 50%. This breakthrough is key for manufacturing microfluidic and 3D sensor components, offering optimal settings for the technique.